View GL6ZV27_1245014.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

PREPARED BY: Sdt3 7 (/Ledc APPROVED BY: Jti`, 33' J L&S&
DATE: I( &M DATE: / /Myy ELECTRO~c CObiPONENTS GROUP SHARP CORPORATION
I I
SPECNo. ISSUE
Ix996046 hut/l 6/99
SPECIJWATION
DEVICE SPECIFICATION FOR
Light Emitting Diode
MODEL No.
\
GL6ZV27
1. Thesespecificationsheets include materialsprotectedunderthe copyright of SharpCorporation ("Sharp"). Please not reproduceor causeanyone to reproducethemwithout Sharpsconsent. do 2. When usingthis product, pleaseobservethe absolute maximumratingsandthe instructionsfor useoutlined in thesespecificationsheets, well asthe precautions as mentioned below.Sharpassumes responsibility no for any damage resultingfrom useof the product which doesnot comply with the absolutemaximum ratings and the instructionsincluded in thesespecification sheets, the precautions and mentioned below. (Precautions) (1) This productsis designed usein the following application for areas; * OA equipment * Audio visual equipment * Homeappliance equipment * Telecommunication equipment(Terminal) * Measuring * Tooling machines * Computers 1 L If the useof the product in the above applicationareas for equipmentlisted in paragraphs is (2) or (3), please sureto observethe precautions be given in thoserespectiveparagraphs. (2) Appropriate measures. suchasfail-safe designandredundant designconsidering the safety designof the overall systemandequipment, should takento ensurereliability be and safety when this product is usedfor equipment whichdemands high reliability and safety in function and precision,suchas ; * Transportationcontrol andsafety equipment (aircraft, train, automobileetc.) * Traffic signals * Gasleakagesensor breakers * Rescue security equipment and * Other safety equipment [ (3) Please not usethis product for equipmentwhich requireextremely high reliability do and safety in function andprecision,suchas ; equipment trunk lines) (for * Spaceequipment * Telecommunication c * Nuclear power control equipment * Medical equipment (4) Please contact and consult with a Sharpsales representative there areany questions if regardinginterpretation of the above three paragraphs. 3. Please contact andconsult with a Sharpsalesrepresentative anyquestions for aboutthis product. Jm /fC DATE: PRESENTED BY: , 3fQ@@ M.Katoh, DepartmentGeneralManager of EngineeringDeptJII Optc-Electronic Devices Division Electronic Components Group SHARP CORPORATION
1
/Y ry
CUSTOMER'S APPROVAL
`DATE:
BY:
DG996046
MODEL No.
Jun/16/99
PAGE
GL6ZV27
l/10
GL6ZV27
Snecifrcation
1. Application This specificationappliesto the light emitting diode deviceModel No. GL6ZV27. [AlGaInP (dicing or scribe/braketype> Amber LED device]
2. Outline dimensions pin COMeCtiOIIS and
. . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attachedsheetPage2.
. 3. Ratingsandcharacteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attachedsheetPage3-4. 3- 1. Absolute maximumratings 3-2. Eleciro-optical characteristics 3-3. Derating Curve 3-4. CharacteristicsDiagram
4. Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attachedsheetPage5. 4-1. Test itemsandtest conditions 4-2. MeasurementitemsandFailure judgementcriteria
Refer to the attachedsheetPage6. 5. Incoming inspection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..*.............o 5- 1. Applied standard 5-2. Samplingmethodandlevel 5-3. Test items,judgementcriteria andclassificaof defect 5-4. Test itemsthe surfaceis be appliedfor fiat type, judgementcriteria andclassifrcaof defect
6. Supplement. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..~ Refer to the attachedsheetPage7-8. 6-l. Packing 6-2. Luminousintensity rank 6-3. Dominant wavelengthrank 64. Environment
7. Precautionsfor use. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attachedsheetPage9- 10. 7- 1. Lead forming method 7-2. Notice of installation 7-3. Soldering Conditions .7-4. For cleaning
DG996046
JllnA6/%
MODELNo.
PAGE GL6ZV27 I z/l0
I
2. Outline dimensions and pin
COMeCtionS
5. 8 20. 2
9,
I I/ I
Colorless
transparency
0
unit mm
I %bI
Finish Lead : Sn plated or wave soidering
l-t2.54
OM
pin 0. 0.
COMIXtiOIlS Anode cathode
ote) Unspecified tol. to be ~0.2m-n ate) Cold rolled steel leads are plated with but the tie-bar cut portions have no plating do not solder this part of the product. Material Lead : (Fe) Cold rolled steel Package : Epoxy resin Drawing No. 51106027
DG996046 MODEL No. GL6ZV27
Jun/16/99 PAGE 3110
3. Ratings
and characteristics
(Note 1) Duty ratio=l/lO,Pulse width=O.lms (Note 2) At the position of 1.6m.m from the bottom resin package 3-2. Electra-optical Parameter Forward voltage characteristics Sylllbol
vF
Conditions
MIN. -
TYP. 2.1
(Ta=25"C MAX. unit 2.6 V
LLlminous interlsity (Note 3) Peak emission wavelength Dominantwavelength Spectrumradiationbandwidth Reversecurrent
Iv
J-P
IF=2OmA
Terminal capacitance Viewing Xaxis Angle YilXiS (Note 3) Refer to the suplementitem 6. regarding the standard rank cla ;ification. of 3-3. DeratingCurve
Ad A ;1 I, Ct 28 l/2
VR=4V V=OV.f=lMHz IF=2OmA
w
Current Derating Curve
Peak
Forward
Current
Derating
Curve
Forward
120 a .5 z g ," 2
-0
60 50 40 30 20 10 0 -25 0 Ambient 25 50 7585 100 125 -25 0 Ambient 25 50 75 85 100 TarC) 125
100 80 60 40 20
"
ii i ," :
Temperature
Ta("C)
Temperature
DG996046 MODEL No.
Juni16i99 PAGE
4ilO
GL6ZV27
Peak
Forward
Current
vs.
Duty
Ratio CTa=25oC)
.lO l/l00 Duty l/10 Raito 1 DR 10
3-4. CharacteristicsDiagram&p) (Note 1)
Forward Current vs.Forward Voltage CTa=25t) Relative vs. Luminous Intensity Ambient Temperature ( I F=2ChnA)
loo
CL
0.1
j
I Ii Ii iI iI iI irl i1 iI iI iI iI iI / iI I III I I
1.21.41.61.8 Forward Voltage 2 2.22.42.6 VFW)
z .: E -
10 -60-40-20 Ambient 0 20 40 Temprature 60 80 100120 Ta ("C).
1
Ralrtive
Luminous
Intensity
vs.
Frorard
Voltue
(Ta%?!.%) 1000
B
0. 01 0. 1 Forward 1 Current 10 IFhA) 100
(Note 1) Above characteristicdata are typical data andnot a guarantteed data.
DG996O46
MODEL No.
I Jld16/95
1 PAGE
GL6ZV27
S/10
4. Reliability The reliability of productsshallbe satisfiedwith itemslisted below. ,-1. Test itemsandtest conditions Test items Solderability Soldering temperature Mechanicalshock Variable frequency vibration Terminalstrength (Tension) Terminal strength (Bending) Temperature cycling Hgh temp'andhigh humidity storage Test conditions 230t5"C. 5s Prior disposition: Dip in rosin flux 26Oc-5C. 5s 15 000m/s2, 05ms. 3times/ iX.*Y,fz direction 2OOm/s*, to 2 000 to 1OOHzJsweep 4min. 100 for ,4timeskX,ktY&Z direction Weight: 1ON,S/each terminal Weight:SN, 0" -+ 90" * 0" /each terminal -90" -0" Conlidencelevel: 9046 LTPD Samples (n) Defective (C) (%) n=ll, C=O n=ll,C=O n=ll. C=O n=ll, C=0 n=ll,C=O n=ll,C=O n=22, C=O n=22, C=0 n=22, C=O n=22, C=O n=22, C=O 20 20 20 20 20 20 10 10 10 10 10
-40"c(30min)~+100"c(3Omin),30 cycles Ta=+6O"c, 9O%RH, t=100Oh
igh temperature storage Ta=lOO"C, t=lOOOh ow temperature storageTa=-40"C, t=lOOOh Operationlife Ta=25"C. &MAX, t=10O0h*3
4-2. Measurement itemsand Failurejudgementcriteria *l Measurement Forward voltage Reversecurrent Luminousintensity Symbol
VF
Failurejudgementcriteria *2 v, > U.S.L. x 1.2 IR > u..%. x 2.0 Iv > The first stagevalue X 2.0 or The first stagevalueX 0.5 > Iv
IR
Iv
s Solderability : Soldershallbe adhereat the areaof 95% or moreof dippedportion. z Terminal strength: Packageis not destroyed,and terminal is not slack. *l: Measuringcondition is in accordance with specification. *2: U.S.L. is shownby Upper Specification Limit. *3: IF m.is shownby forward current of absolutemaximumratings.
DG996046
MODEL No.
Jlud16/9!I
PAGE
GL6ZV27
6110
5. Incoming inspection 5-1. Applied standard IS0 2859-l : 5-2. Samplingmethod level : A singlesamplingpIan,normal and inspection level II : AQL Major defect : 0.065% Minor defect : 0.4%
.
T-3
-.
Tmt
* -"-
itwr~c
.--.."*
idwmrnt
-
-----
m-it&a
-. .-.
--
and
--
chxnifica
-------
nf defect
------
YO.
Test items Disconnection Positionof Cutting off rim Reverse terminal Outline dimensions characteristics Cutofftherim Foreignsubstance Scratch Void Unevendensityof materialfor scattering Unbalanced center Burr Insertionpositionof terminal
judgementcriteria Not emit light Different from dimension Different from dimension Not satisfy outlinespecification Over the limit value of specification V,, Ia, andIv at Exceed -0.2mm White point : Exceed 4 0.3mm (on top view) Black point : Exceed 4 0.3nun (on top view) String form : Exceed 3.Omm(on top view) Exceed # 0.3mm or O.lmm x l.Omm(on top view) Exceed 4 0.3mm (ontop view) Extremely unevendensity Exceed fo.25mm from package center Exceed +0.2mm againstprovided dimension Insertion positionof terminal
classifica of defec
1 2 3 4 5 6 7 8 9 10 11 12 13
Major defect
Minor defect
5-4. Test itemsthe surfaceis be applied for flat type, judgement criteria andclassificaof defect No.
14
Test items Chapped surface the Hollow the surface
judgementcriteria The surfacechappedis striking for seethe lamptop The surfacehollow is striking for seethe lamptop
classificaof defec Minor defect
15
DG996046 MODEL No.
GL6ZV27
Jun/16/!x PAGE 7110
6. Supplement 6-l. Packing 6-l-l. Inner package Put 25Opcs the same luminous intensity rank products into pack and put following label by pack. Product weight : 0.28g (One Product,Typ.) (Tdication label sample) SHIPUENT TABLE PART No. GL6ZV27 + Model number *clcl clclclclcl QUANTITY 250 + Quantity of products -~-KA99B19 + Lot number * LOT No. Q@ 0 a -0 R-0 tLuminous intensity rank dominant wavelength rank SHARP' MADE IN JAPAN + Production country 0 @ @ @ @ Production plant code(to be indicated alphabetically) Support code Year of production(the last two figures of the year) (to be indicated alphabetically with January corresponding to A) Month of production Date of production(Ol-31)
6-l-2. Outer package Put 8 packs (the same luminous intensity rank) into outer package. (approximately 670g per one outer package) 6-l-3. Outer package out line dimension Width: 14Omm, Depth : 225mm. Hight : 90mm 6-2.Luminous intensity rank (Note 1) Rank Luminous intensity I 185 360 J 266 518 K 383 746 I L 552 ( 1075 (Ta=25"c ) unit mcd
j
Condition 1~2omA
I
(Note 1) Tolersnce:flS% In regard to luminous intensity , the following ranking shall be carried out. However the quantity of each rank shall not be pre scribed. In case of the distribution of the luminous intensity shift to high, at that point new upper rank is prescribed and lower rank is delete.
1
I I (Note 2) The condition of measurement : The measurement of the light emission from the front side of lamp. This rank value is the setting value of when that classifies it the rank and be not a guarantee value. Also I shall not ask the delivery ratio of each rank.
L
1
591.0
-
594.5
1
Do996046
MODEL. No.
Jun/16/!39
PAGE
GL6ZV27
8110
6-4. Environment 641. Ozonosphere destructive chemicals. (1) The &vice does& contain following substance. (2) The &vice doesn't have a production line whose process requires following substance. Restricted part: CF~on~CC~o~~~e~yc~o~fo~) 642. Bromic non-burning materials The &vice doesn't contain bromic non-burning materials(PBBOs,PBBs)
IX996046
MODEL No. GL6ZV27
Jud16/99
PAGE g/10
7. Precautions
for use
7 - 1. Lead forming method Avoid fowing a lead pin with the lead pin base as a fulcrum:be sure to hold a lead pin firmly when forming. Lead pins should be formed before soldering. 7 - 2. Notice of installation 7-Z-l installation on a P W B &en mounting an LED lamp on a PIIB.do not apply physical stress to the lead pins. *The lead pin pitch should match the PYBpin-hole pitch:absolutely avoid widening or narrowing the lead pins. Ihen positioning an LED lamp,basically employ an LEDwith tie-bar cut or use a spacer. 7-2-2 Whenan LED 1 is mounted directly on a P WB If the bottom face of an LED lamp is mounted directly on single-sided PVBthe base of the lead pins way be subjected to physical stress due to PWB warp.cutting or clinching of lead pins. Prior to use, be sure to check that no disconnection inside of the resin or damageto resin etc., is found. when an LED lamp is mounted on a double-sided PWB,theheat during soldering affects the resin;therefore.keep the LED lamp more that 1.6nunafloat above the PRI. 7-2-3 Installation using a holder During an LED lamp positioning,when a holder is used, a holder should be designed not to subject lead pins to any undue stress. (Note)Pay attention to the themal expansion coefficient of the material used for the holder.Since the holder expands and contracts due to preheat and soldering heat, mechanical stress may be applied to the lead pins, resulting in disconnection. 7-2-4 Installation to the case Do not fix part C with adhesives when fixed to the case as shown in Figure.A hole of the case should be designed not to subject the inside of resin to any undue stress.
l
Good
Do6046
iMODEL No.
Jud16/99
PAGE I lO/lO
I
GL6ZV27
7 - 3. S oldering Conditions Solder the lead pins under the following conditions Conditions Type of Soldering 1 I 1. Manual soldering 295"C*YC, within 3 seconds 26O"c+5`C. within 5 seconds 2. Wave soldering 3. Auto soldering Preheating 70C to 80C. within 30 seconds Soldering 245"c+5"c, within 5 seconds (Note) Avoid dipping resin into soldering bath. Avoid applying stress to lead pins while they are heated-For example , when the LED lamp is moved with the heat applied to the lead pins during manual soldering or solder repair,disconnection may occur.
7 - 4. For cleaning ( 1) (2) Solvent cleaning : Solvent temperature 45C or less Immersion for 3 min or less Ultrasonic cleaning : The effect to device by ultrasonic cleaning differs by cleaning bath size,ultrasonic power output,cleaning time,PIB size or device mounting condition etc. Please test it in actual using condition and confirm that doesn't occur any defect before starting the ultrasonic cleaning.
( 3 > Applicable solvent : Ethyl alcohol, Methyl alcohol, Isopropyl alcohol In case when the other solvent is u&there are cases that the packaging resin is eroded. Please use the other solvent after thorough confirmation is performed in actual using condition.

▲Up To Search▲

Price & Availability of GL6ZV27

	To Download GL6ZV27 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .